Socket / Footprint / IC Package Types w/ Dimensions

PGA - Pin Grid Array

QFP - Quad Flat Pack.See: Footprint

• CQFP (Ceramic Quad Flat Pack)
• FQFP (Fine-pitch Quad Flat Pack)
• GQFP (Guard-ring Quad Flat Pack)
• HLQFP (TI, Thermally-enhanced Low-Profile Quad Flat Pack)
• HTQFP (TI, Thermally-enhanced Thin Quad Flat Pack)
• LQFP (Low-Profile Quad Flat Pack)
• MC-QFP (Multilayer Ceramic Quad Flat Pack or Metalized Ceramic Quad Flat Pack)
• MQFP (Metric Quad Flat Pack or Metal Quad Flat Pack)
• PC-QFP (Printed Circuit-based Quad Flat Pack)
• PQFP (Plastic Quad Flat Pack) See: Footprint
• RQFP (Altera, Power Quad Flat Pack, go figure)
• SQFP (Shrink Quad Flat Pack)
• TPQFP (Test-pad Quad Flat Pack)
• TQFP (Thin Quad Flat Pack or Tape Quad Flat Pack) See: Footprint
• UTQFP (Ultra-thin Quad Flat Pack)
• VQFP (Very-fine pitch Quad Flat Pack or Very-thin Quad Flat Pack)
• VSQFP (Very Small Quad Flat Pack)

PLCC - Plastic Leaded Chip Carrier. See: Footprint

DIP - Dual Inline Package. See: Footprint

PDIP - Plastic Dual Inline Package. See: Footprint

CDIP - Ceramic Dual Inline Package

SDIP - Skinny DIP (300 mil body) See: Footprint

SOIC - Small Outline IC. See: Footprint

BGA - Ball Grid Array.

SOJ - Small Outline. See: Footprint

WSOJ -  400mil Small Outline. See: Footprint

SOP - Small Outline. See: Footprint

SSOP - Shrink Small Outline. See: Footprint

TSOP. Thin Small Outline Package. See: Footprint

STSOP. Small TSOP See: Footprint

See also:

• http://dir.yahoo.com/Business_and_Economy/Companies/Electronics/Business_to_Business/Board_Level_Components/Makers/Electromechanical/Connectors__Sockets_and_Terminal_Blocks/
• http://www.hardwarebook.net/ connector pinouts and cable descriptions.
• http://www.richtek.com/OrderInfo/Docs/Footprints-050303.pdf Footprint details for a range of SMT packages
• http://www.siongboon.com/projects/2005-09-07_home_pcb_fabrication/footprint/index.htm

Questions: